Application Proposal

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Application Proposal

Processing of electronic components

Dicing

Dicing

Strongly fixed in room-temp.

Cutting

Cutting

Hold the workpiece strongly in cutting temp.

Carrier

Carrier

Smooth carrier is possible
by controlling adhesion

Transfer

Transfer

Suggest a new process by using temp.

Processing of flexible devices

Temporary fixing (thin-film glass)

Temporary fixing (thin-film glass)

Suitable for temporary fixing thin-film glass

Carrier / Supporting

Carrier / Supporting

Smooth carrier is possible
by controlling adhesion

Wafer processing

Grinding / Polishing

Grinding / Polishing

Realizes good machining accuracy

Dicing

Dicing

Strongly fixed in room-temp.

Others

Carrier

Carrier

Smooth carrier is possible
by controlling adhesion

Transfer

Transfer

Suggest new process by using temp.

Nail art

Nail art

Provide a new value by using temp.

Masking

Masking

Good peelability

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